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RESEARCH ARTICLE   Open Access    

Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro

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    Kamil Elkhoury, Belal Shohayeb, Guan‐Lin Chen, Erfan Noorbakhsh Noshahri, Julio Zuazola, Dan Ohtan Wang, Nikhil Gupta, Sanjairaj Vijayavenkataraman. 2026. Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro. Engineering in Life Sciences. 26:78 doi: 10.1002/elsc.70078
    Kamil Elkhoury, Belal Shohayeb, Guan‐Lin Chen, Erfan Noorbakhsh Noshahri, Julio Zuazola, Dan Ohtan Wang, Nikhil Gupta, Sanjairaj Vijayavenkataraman. 2026. Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro. Engineering in Life Sciences. 26:78 doi: 10.1002/elsc.70078

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Research Article   Open Access    

Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro

Engineering in Life Sciences  26(4) Article number: 10.1002/elsc.70078  (2026)  |  Cite this article
    • Copyright: © 2026 by the author(s). Exclusive Licensee Maximum Academic Press, Fayetteville, GA. This article is an open access article distributed under Creative Commons Attribution License (CC BY 4.0), visit https://creativecommons.org/licenses/by/4.0/.
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    Cite this article
    Kamil Elkhoury, Belal Shohayeb, Guan‐Lin Chen, Erfan Noorbakhsh Noshahri, Julio Zuazola, Dan Ohtan Wang, Nikhil Gupta, Sanjairaj Vijayavenkataraman. 2026. Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro. Engineering in Life Sciences. 26:78 doi: 10.1002/elsc.70078
    Kamil Elkhoury, Belal Shohayeb, Guan‐Lin Chen, Erfan Noorbakhsh Noshahri, Julio Zuazola, Dan Ohtan Wang, Nikhil Gupta, Sanjairaj Vijayavenkataraman. 2026. Filament Extrusion‐Based Conductive TPU Composite Scaffolds Enable Superior Neuronal Growth and Synaptic Maturation In Vitro. Engineering in Life Sciences. 26:78 doi: 10.1002/elsc.70078
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